Tape applicator head

ABSTRACT

An applicator head for applying an adhesive tape on a surface or substrate, wherein the adhesive tape comprises a material and at least one removable liner, the applicator head comprising: an application tip; a cutting mechanism positioned adjacent an outer most point of the application tip; a positioning device is configured such that the cutting mechanism severs the material while maintaining the at least one removable liner intact.

FIELD

The present disclosure relates to an automated apparatus for applicationof adhesive tape on a substrate.

BACKGROUND

Adhesive-backed tape is commonly applied to body surfaces, interior andexterior claddings and panels (e.g. trim, moldings, covers, trays,panels, doors and hatches) of a vehicle (e.g., an automobile, aircraft,or watercraft), or structures (e.g. buildings, HVAC units). For example,an adhesive-backed tape mounted around the periphery of a cladding on avehicle component provides a seal which helps to control waterintrusion, and reduce cabin noise due to wind when the vehicle is inmotion, as well as control dust intrusion into the cabin and engineparts. Such tapes may be manually installed, however such a process isnot only slow, but labour intensive, and prone to human error. Inaddition, the application process may not be uniform, predictable orreproducible.

Several methods have been proposed to apply adhesive-backed tape onsubstrates, such as those employing robotic end effectors or fixedapplicators. However, these methods suffer from several challenges, suchas, inaccurate placement of the adhesive tape, constant cycleinterruptions due to jams within the equipment, tape breakages due tolack of adequate tension control, and the inevitable downtime due tospool changes during a production cycle. Furthermore, industry adoptionof automated applicator equipment has been slow for numerous reasonssuch as: application geometry constraints (i.e. having a large rollmounted on the applicator head), speed and volume of application, as theroll size is limited, cell design constraints. In addition, existingequipment is typically only capable of holding/dispensing rolls of tapethat are less than 40 meters in length, and therefore this equipment isincapable of keeping up with the production demands

SUMMARY OF THE INVENTION

In one of its aspects, there is provided an applicator head for applyingan adhesive tape on a surface or substrate, wherein the adhesive tapecomprises a material and at least one removable liner, the applicatorhead comprising:

-   -   an application tip;    -   a cutting mechanism positioned adjacent an outer most point of        the application tip;    -   a positioning device is configured such that the cutting        mechanism severs the material while maintaining the at least one        removable liner intact.

Advantageously, the applicator head is useful in an exemplary robotizedtape application system, and allows for faster application rates, andincreased efficiency; accurate and consistent application of the tape;reduced labor costs and increased flexibility by allowing for longerapplication times, and application of tape in more complex paths on thesubstrate. In addition, the robotized tape application minimizes humanintervention and human error during runtime.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 a shows a perspective view of an exemplary robotic adhesive tapeapplication system;

FIG. 1 b shows an exemplary tape;

FIG. 1 c shows another exemplary tape;

FIG. 1 d shows a roll of the exemplary tape;

FIG. 1 e shows spools of the exemplary tape;

FIGS. 2 a to 2 c show perspective views of an exemplary spool payoutdevice;

FIG. 3 shows a perspective view of an exemplary applicator head;

FIG. 4 shows a view of an exemplary application tip;

FIGS. 5 a-c show a flowchart outlining exemplary steps for a method forapplying an adhesive tape to a substrate or a surface; and

FIG. 6 shows an exemplary computing system.

DETAILED DESCRIPTION

Various embodiments of the disclosure are discussed in detail below.While specific implementations are discussed, it should be understoodthat this is done for illustration purposes only. A person skilled inthe relevant art will recognize that other components and configurationsmay be used without parting from the spirit and scope of the disclosure.Like reference numerals are used to designate like parts in theaccompanying drawings.

The detailed description provided below in connection with the appendeddrawings is intended as a description of the present examples and is notintended to represent the only forms in which the present example may beconstructed or used. However, the same or equivalent functions andsequences may be accomplished by different examples.

Referring to FIGS. 1 a-e , there is shown a robotic tape applicatorsystem for attaching a tape to a receiving surface or a substrate,generally identified by numeral 10, in an exemplary embodiment. FIGS. 1b and 1 c show tape 11, such as adhesive tape, or double-sided tape,comprising material 12 and tape liner 13, while FIGS. 1 d and 1 e show aroll and spool of adhesive lined tape 11, respectively. System 10comprises payout device 14 which feeds adhesive tape 11 into flexibleconduit 15 terminating at adhesive tape applicator head 18 mounted onrobotic arm 19 of an industrial robot 20 with various axisconfigurations. For example, the industrial robot may include six axes,or six degrees of freedom, which allow for greater flexibility.Accordingly, flexible conduit 15 bends as needed based on the movementsof robotic arm 19. Flexible conduit 15 comprises infeed conduit 16through which adhesive tape 11 is conveyed from payout device 14 toapplicator head 18, and alongside flexible infeed conduit 16 is flexibleoutfeed conduit 21 which transports liner 13 which is removed frommaterial 12 and dispensed during the application process.

Now referring to FIGS. 2 a-c , payout device 14 comprises payout spoolshaft 30 rotatably attached to the mounting frame 32, and payout spoolshaft or spindle 30 receives payout spool 34 of adhesive tape 11.Examples of elastomeric adhesive lined tape 11, include, but are notlimited to, crushed ethylene propylene diene monomers (EPDM); neopreneclosed cell; expanded polyvinyl chloride (PVC); polyethylene; acrylicfoam tapes (e.g. very high bond (VHB) tape); weld-thru tapes, sealertapes, electrical circuit tapes, heat activated tapes. Material 11 mayinclude a range of widths, thickness and length depending on theapplication. In one example, material 11 comprises a width ranging from1.5 mm to 25 mm or material thickness ranges from 0.05 mm to 20 mm. Inother implementations, adhesive tape 11 can be fed from any type of tapedispensing means or tape supply means, such as a conveying platform.Payout device 14 also comprises system controller 40 which exchangessignals with associated components, such as, sensors, motors, actuators,and communicates with robotic arm 19, and applicator head 18 and othercomponents, to provide tape 11 on demand as called for by applicatorhead 18 in a relatively fast, accurate and consistent manner. Humanmachine interface 42 is communicatively coupled to system controller 40for inputting program instructions and configure system 10 settings, andoutputting alerts, warnings, notifications and displaying system 10settings. System controller 40 comprises board logic or programmablecircuitry or a processor.

In more detail, payout spool 34 of tape 11 is unwound by toggling spoolbrake 44 on and off, and tape 11 is fed through a series of lowerpulleys 46 and upper pulleys 48 of tape material accumulator 50.Alternatively, a spool motor is controllable to initiate and stoprotation of payout spool shaft 30 or regulate the rotational speed ofpayout spool shaft 30. Pulleys 46, 48 accumulate tape 11 for on the flyspool changes, and account for any feeding variances, as will beexplained later. Lower pulleys 46 are mounted on lower pulley arm 52,and upper pulleys are mounted on upper pulley arm 54. Lower pulley arm52 slides vertically, such that the position of lower pulley arm 52determines the length of tape 11 stored in accumulator 50. As tape 11 isdispensed, lower pulley arm 52 rises, and the amount of stored tape 11decreases. As an example, in the upper most position of lower pulley arm52 there may be 2 meters of tape 11 in accumulator 50, while in thelower most position of lower pulley arm 52 there could be as much as 20meters of tape 11 depending on the number of pulleys 46, 48 and windingsof tape 11.

Accumulator position sensor 60 is mounted on frame 32 of accumulator 50to detect the position of movable lower pulley arm 52, and spool levelsensor 68 detects amount of tape 11 on payout spool 34. Accumulatorposition sensor 60 comprises a plurality of set points e.g. lower limitand upper limit. For example, when lower pulley arm 52 passes the upperlimit set point spool brake 44 is released to allow new tape 11 to feedinto accumulator 50, as lower pulley arm 52 falls under the force ofgravity, spool 34 unwinds and accumulator 50 fills with tape 11. Whenlower pulley arm 52 passes the lower limit set point brake 44 isre-applied to stop spool 34 unwinding. Next, tape 11 exits accumulator50 into payout drive mechanism 70, which indexes tape 11 out towardsrobotic arm 19 via flexible infeed conduit 16 at a controlled, meteredrate as it is called for by applicator head 18. Drive mechanism 70 mayinclude servo motors or stepper motors, pulleys, to control theadvancement of tape 11 to applicator head 18. When spool level sensor 68indicates spool 34 is empty, or close to being completely depleted,payout device 14 switches into a spool change mode, as will be describedlater. Alternatively, accumulator 50 is associated with at least oneaccumulator position sensor 60 which determines a numerical position oftape 11 in accumulator 50, ranging from a predefined low threshold to apredefined high threshold. When tape 11 in accumulator 50 reaches thelow threshold payout spool 34 of tape 11 is unwound by toggling spoolbrake 44 off or actuating spool motor to rotate payout spool shaft 30,and feed tape 11 through a series of lower pulleys 46 and upper pulleys48 of tape material accumulator 50. In another implementation,accumulator position sensor 60 comprises a plurality of sensors locatedat different positions associated with the lower limit and the higherlimit.

Payout drive mechanism 70 comprises fluid amplifier 72 which creates avacuum effect inside therein to effectively reduce frictional forcesbetween tape 11 and the interior wall of flexible conduit 16 as tape 11is fed along flexible conduit 16 towards applicator head 18. The vacuumis activated only when payout drive mechanism 70 is feeding new tape 11.

Looking at FIGS. 3 and 4 , tape 11 exits flexible tube 16 at roboticapplicator head 18, and tape 11 is wound around material buffer 80 bybuffer refill mechanism 82. Generally, material buffer 80 is a loop oftape 11, or a reserve, of variable size, which accounts for feedingvariances between payout drive mechanism 70 and head drive mechanism 90and promotes application of consistent tension to tape 11, or controlsthe tension forces associated with tape 11. In one implementation,buffer refill mechanism comprises resilient means and a slide mechanism,such that as material buffer 80 shrinks, sensor 92 detects the level ofcompressed buffer loop 101 and commands payout drive mechanism 70 tosend more tape 11 causing material buffer 80 to grow again.

Material buffer 80 is associated with buffer sensor 92 which determinesa numerical position of material buffer 80, ranging from a predefinedlow threshold to a predefined high threshold. When material buffer 80reaches the low threshold payout drive mechanism 70 is called upon tofeed additional tape 11 to refill material buffer 80. When the bufferreaches the high threshold payout drive mechanism 70 is shut off. Thenumerical data being measured by position sensor 92 can predict tape 11jams and tape 11 breakages and shut down system 10, thereby minimizingany possible further damage or equipment faults.

Next, head drive mechanism 90 is actuated and feeds tape 11 frommaterial buffer 80 towards the application tip 100. Similar to drivemechanism 70, head drive mechanism 90 may include servo motors orstepper motors to control the advancement of tape 11 to applicator tip100. For example, head drive mechanism 90 comprises a set of rollers orgears coupled to an electric motor, and configured to pull tape 11around application tip 100, as shown in FIGS. 3 and 4 . Material 12 ispeeled off liner 13, or vice versa, by virtue of the geometry ofapplication tip 100, which comprises rounded member 102, exposing theadhesive layer. Material 12 is advanced to application tip 100 prior tothe commencement of the application of material 12 to the substrate, andbuffer 101 includes a loop of tape 11 which accounts for feedingvariances between payout drive mechanism 70 and head drive mechanism 90and to ensure consistent tension is applied to tape 11, and assist withpeeling off liner 13, and feeding tape 11. Accordingly, followingprogram instructions executable by system controller 40 robotic arm 19moves to the start position on the substrate and applicator head 18begins to apply material 12 along a predefined application path whilesending a feed command to actuate head drive mechanism 90 to index moretape 11, as needed. The predefined paths may be linear, nonlinear,three-dimensional, and so forth. In some instances, specialized hardwareassociated with robotic arm 19 determines the speed of robotic arm 19movements, and transmits that speed to system controller 40, and thespeed of head drive mechanism 90 is automatically adjusted to match thespeed of the movements of the robotic arm 19. In other instances, thespeeds may be calculated and manually adjusted in the program. With theaid of encoders or other tracking means, system controller 40 candetermine the amount of tape 11 passing under applicator tip 100,including the precise location where tape 11 is to be applied.

As material 12 is applied, wet-out roller 104 associated with applicatorhead 18 follows the path of applied material 12 and applies pressure tomaterial 12 to enhance adherement; or activate the adhesive onpressure-sensitive adhesive tapes 11. In some implementations, anadditional tool is used to apply adhesion promoter on the substrate,such as along the predefined application path, before material 12 isapplied. A vision system may be used to detect the presence of adhesionpromoter on the substrate, and automatically apply material 12 to thesensed locations on the substrate. When applicator head 18 reaches theend of its pre-programmed application path it sends a command to systemcontroller 40. Next, a cut sequence commences, and entails commandingblade actuator 95 to actuate and cause straight blade 106 to sever tape11. Straight blade 106 performs a precision kiss cut by severingmaterial 12 without severing liner 13 underlying material 12.Accordingly, the speed and depth of straight blade 106 into material 12is precisely calibrated and stored in the calibration parameters inmemory means associated with system controller 40, and may be dependenton the thickness of material 12 and liner 13. Alternatively, the speedand depth of straight blade 106 into material 11 is precisely calibratedvia mechanical means. For example, a positioning device comprising oneof a threaded adjuster, an eccentric lobe, and a stop capable ofmodification to suit a predetermined thickness, for performingadjustments. Blade actuator 95 may be any one a fluidic muscle, electricactuator, pneumatic actuator, and a hydraulic actuator. Upon completionof the cut, robotic arm 19 makes a final move to apply the lastmillimeters of material 12 up to the cut location and rolls material 12with wet-out roller 104. In other implementations, blade 106 may beserrated or non-serrated, angled, curved, or heated to enhance thecutting sequence.

As head drive mechanism 90 draws tape 11, head drive mechanism 90simultaneously expels spent liner 13, and guides liner 13 into outfeedtube 21 for disposal. Similar to infeed tube 16, outfeed tube 21includes outfeed fluid amplifier 73 to pull the spent liner 13 away fromapplicator head 18 towards payout device 14, where used liner 13 iscollected in a disposal bin 110. Payout device 14 may include cuttingdevice 66 to cut used liner 13 to manageable sizes to facilitatedisposal.

An operating cycle of system 10 will now be described with reference toa flow charts 200 a-c as shown in FIGS. 5 a-c . In step 202 of thecycle, robotic arm 19 in a cell receives a start command from anexternal source having programmed instructions to apply adhesive tape 11along a predefined path on a substrate. In accordance with theinstructions, robotic arm 19 moves to a start position and the externalsource sends a robot in position signal (204), and system controller 40determines whether payout device 14 is in auto mode (205) When payoutdevice 14 is in auto mode then system controller 40 activates fluidamplifier 73 (211), otherwise system controller 40 determines theconditions of accumulator 50 and payout spool 34 based on the statussignals from the accumulator sensor 60, and spool level sensor 68, step206. Next, via human machine interface 42, operator instructs systemcontroller 40 to reset payout device 14 to home position (208) andswitches payout device 14 to auto mode (209). In step 210, systemcontroller 40 determines whether payout device 14 is in auto mode, andwhen payout device 14 is not in auto mode the process returns to step206, otherwise system controller 40 activates payout drive mechanism 70,fluid amplifier 72 to feed material 11 along flexible infeed conduit 16towards applicator head 18 (211), including head drive mechanism 90 tofeed material 11 to the application tip 100 (212).

In step 214, robotic arm 19 commences applying tape 11 along thepredefined path on the substrate, and head drive mechanism 90 indexesmaterial 11 in relation to robotic arm 19 movement. As material 11 isapplied to the substrate, the length of material 11 in buffer loop 101of applicator head 18 diminishes (215), and system controller 40continually determines the level of buffer 101 based on the outputsignals from buffer sensor 92 (222). At the end of the predefined path,robotic arm 19 stops and signals system controller 40 (216), and systemcontroller 40 issues a command to head drive mechanism 90 to stopindexing material 11 and another command to applicator head 18 toactuate straight blade 106 to sever material 11 (217), and the processcontinues with robotic arm 19 applying material 11 at a new location ofthe predefined path, or another predefined path on the substrate. Instep 218, robotic arm 19 completes the final path movement to apply theremainder of material 11, and payout device 14 issues a cycle completesignal to the external source (219), and the cycle ends.

As material 11 is applied to the substrate, in step 215, the length ofmaterial 11 in buffer 101 of applicator head 18 diminishes (220), andsystem controller 40 continually determines the level of buffer 101based on the output signals from buffer sensor 92 (222). If the level ofbuffer 101 is within a predefined threshold then the process continues(224), otherwise a request for more material 11 is made (226) and systemcontroller 40 activates fluid amplifier 72 to facilitate transport ofmaterial 11 via infeed conduit 16 (228). Payout drive mechanism 70indexes material 11 to applicator head 18 to replenish buffer loop 101(230), and system controller 40 determines whether the level of buffer80 is within the predetermined levels based on the output signals frombuffer sensor 92 (232). When the level of buffer 101 is within thepredetermined levels then the process continues to step 224, otherwise adetermination is made as to whether material 11 feeding has timed out(234), if there is a time out then a fault alarm or notification isissued by system controller 40 alerting an operator to rectify thesituation (236), otherwise the process returns to step 232.

Back to step 215, as material 11 is applied to the substrate the lengthof material 11 in buffer 80 and accumulator 50 also diminishes (238),spool brake 44 is released (240) and lower pulley arm 52 lowers by wayof gravity (242), and system controller 40 determines whether the lowerthreshold has been flagged based on the output from accumulator sensor60 when lower limit set point is triggered (244). When the lowerthreshold has been flagged then spool brake 44 is re-applied (246) andthe process returns to step 238; otherwise the process proceeds to step248 where system controller 40 determines the level of payout spool 34based on the output from payout spool sensor 68. If payout spool sensor68 indicates that payout spool 34 is empty then a fault alarm ornotification is issued by system controller 40 to alert an operator torectify the situation (250), otherwise system controller 40 determineswhether accumulator 50 upper threshold has been flagged (252) based onoutput signals from accumulator sensor 60.

Accordingly, in one implementation, depleted spool 34 may be swapped fora new spool 34 of material 11 without interrupting the application cyclein progress. Accordingly, the spool 34 changeover minimizes productiondowntime. If upper threshold has not been flagged then operationcontinues (253), otherwise material clamp 36 on incoming side ofaccumulator 50 is actuated (254) to clamp the new material 11 enteringaccumulator 50. In step 255 system controller 40 issues an alertnotifying an operator to change spool 34.

While the new material 11 is clamped, payout device 14 continues toindex material 11 to applicator head 18 by using up reserve material 11(e.g. up to 20 meters) stored in accumulator 50, while operator swapsspools 34 within a predefined swap time i.e. the amount of time tocomplete a spool 34 change (256). As an example, the predefined swaptime may be determined by dividing the length (meters) of the reservematerial 11 in accumulator 50 by application rate of material 11 (metersper minute). For example, for a material 11 reserve of 20 meters, and anapplication rate of 1 meter per minute, then the predefined swap time is20 minutes. Generally, the predefined swap time depends on the cycletime of system 10, user preferences and settings. In step 257, whensystem controller 40 determines that the spool change and the spliceprocess is completed before lower pulley arm 52 passes upper limit ofsensor 60, then the process proceeds to step 266, otherwise operation ofpayout device 14 is halted by system controller 40 (258) and operator isalerted by system controller 40 to change spool 34 (256).

Operator cuts material 11 at splice location (259) and operator removesempty spool 34 and loads a new full spool 34 (260). Next, operatorcreates splice joint to join an end of new material 11 to an end ofin-progress material 11 clamped before accumulator 50 (262). Splicingfixture 65 is provided to make these splices expeditiously, and in aconsistent manner Once operator completes the change of spool 34 and thesplice joint, a command is input via human machine interface 42 toindicate completion of the task (264). System controller 40 receives thecompletion signal and deactivates material clamp 36 (266) andaccumulator 50, which was depleted during the splice sequence as pernormal operation, refills (268). When the splice joint reachesapplicator head 18, splice sensor 93 positioned to detect this jointtriggers applicator head 18 to enter a purge cycle. Generally, the purgecycle consists of applying material 11 with the splice to disposalsurface, that is, not on the predefined application path. Once enoughmaterial 11 has been purged to ensure the splice is eliminated, system10 resumes normal operation, and the process ends. Alternatively, theoperator may load a new spool 260 and thread the new material 11 in thepayout device 14 and advance the material 11 to the applicator head 18,that is, without any splice joints.

In one implementation, adhesive tape 11 can be single- or double-sidedtape, in a monolithic or layered format.

In one implementation, material clamp 36 on the incoming side ofaccumulator 50 is manually actuated to clamp the new material 11entering accumulator 50.

In one implementation, material clamp 36 on the incoming side ofaccumulator 50 is electrically actuated to clamp the new material 11entering accumulator 50.

In one implementation, material clamp 36 on the incoming side ofaccumulator 50 is pneumatically actuated to clamp the new material 11entering accumulator 50.

In one implementation, adhesive tape 11 travels through a delaminationdevice comprising rollers configured to separate material 12 andremovable liner 13 from each other temporarily before reapplyingmaterial 12 to removable liner 13 to loosen the bond.

In one implementation, applicator head 18 comprises a vision system,which includes an image capture device to verify the correct applicationof material 11 on the substrate part or work piece, and identifysubstrate features or edges to facilitate self-alignment of applicationtip 100 with the predefined application path.

In one implementation, applicator head 18 comprises a vision system,which includes a laser profiler to verify the correct application ofmaterial 11 on the substrate part or work piece, and identify substratefeatures or edges to facilitate self-alignment of application tip 100with the predefined application path.

In one implementation, application tip 100 comprises means for trackingand calculating the amount of material 11 between blade 106 and theapplication tip 100.

In one implementation, applicator head 18 comprises a sensor located onthe outbound side of applicator tip 100 to sense the presence ofmaterial 11 indicating a failed application

In one implementation, applicator head 18 comprises an attachmentcontaining an adhesion promoter and a device for applying said adhesionpromoter to the substrate.

In one implementation, applicator head 18 comprises an air blowerlocated at the application tip to help peel the material 11 off liner13.

In one implementation, liner 13 is collected and severed into smallermanageable pieces.

In one implementation, applicator head 18 comprises at least one safetydevice for mounting on industrial robot 20.

In one implementation, industrial robot 20 is a servo gantry stylerobot.

In one implementation, industrial robot 20 is a collaborative robot.

In one implementation, applicator head 18 is fixed in position and thepart to receive material 11 is moved to applicator head 18, that is, apart-to-process strategy. In one example, the part may be on a robot orany other means of actuation.

In one implementation, system 10 comprises a ‘quick change’ bladesystem.

In one implementation, system 10 comprises one or more safety devicesmountable on a collaborative robot to enhance safe operation.

In one implementation, drive mechanism 70, 90 comprises a linear gripand pull mechanism, such as a walking beam transfer.

System 10 may be useful in the automotive sector, where material 11 isapplied to automotive interior and exterior trim and claddings to reducenoise, seal moisture and to couple components together; and in theconstruction industry, such as trim and seals for glazing materials e.g.interior and exterior building architectural claddings and HVACequipment.

In one implementation, system 10 is coupled to a measurement or dataacquisition (DAQ) devices, such as, instruments, smart sensors, dataacquisition devices or boards, and any of various types of devices thatare operable to acquire and/or store data.

In one implementation, system controller 40 comprises computing meanswith computing system 300 comprising at least one processor such asprocessor 302, at least one memory device such as memory 304,input/output (I/O) module 306 and communication interface 308, as shownin FIG. 6 . Although computing system 300 is depicted to include onlyone processor 302, computing system 300 may include a number ofprocessors therein. In an embodiment, memory 304 is capable of storinginstructions. Further, the processor 302 is capable of executinginstructions.

In one implementation, processor 302 may be configured to executehard-coded functionality. In an embodiment, processor 302 may beembodied as an executor of software instructions, wherein the softwareinstructions may specifically configure processor 302 to performalgorithms and/or operations described herein when the softwareinstructions are executed.

In one implementation, processor 302 may be embodied as a multi-coreprocessor, a single core processor, or a combination of one or moremulti-core processors and one or more single core processors. Forexample, processor 302 may be embodied as one or more of variousprocessing devices, such as a coprocessor, a microprocessor, acontroller, a digital signal processor (DSP), a processing circuitrywith or without an accompanying DSP, or various other processing devicesincluding integrated circuits such as, for example, an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a microcontroller unit (MCU), a hardware accelerator, aspecial-purpose computer chip, Application-Specific Standard Products(ASSPs), System-on-a-chip systems (SOCs), Complex Programmable LogicDevices (CPLDs), Programmable Logic Controllers (PLC), GraphicsProcessing Units (GPUs), and the like. For example, some or all of thedevice functionality or method sequences may be performed by one or morehardware logic components.

Memory 304 may be embodied as one or more volatile memory devices, oneor more non-volatile memory devices, and/or a combination of one or morevolatile memory devices and non-volatile memory devices. For example,memory 304 may be embodied as magnetic storage devices (such as harddisk drives, floppy disks, magnetic tapes, etc.), optical magneticstorage devices (e.g., magneto-optical disks), CD-ROM (compact disc readonly memory), CD-R (compact disc recordable), CD-R/W (compact discrewritable), DVD (Digital Versatile Disc), BD (BLU-RAY™ Disc), andsemiconductor memories (such as mask ROM, PROM (programmable ROM), EPROM(erasable PROM), flash ROM, RAM (random access memory), etc.).

I/O module 306 is configured to facilitate provisioning of an output toa user of computing system 300 and/or for receiving an input from theuser of computing system 300, and send/receive communications to/fromthe various sensors, components, and actuators of system 10. I/O module306 is configured to be in communication with processor 302 and memory304. Examples of the I/O module 306 include, but are not limited to, aninput interface and/or an output interface. Some examples of the inputinterface may include, but are not limited to, a keyboard, a mouse, ajoystick, a keypad, a touch screen, soft keys, a microphone, and thelike. Some examples of the output interface may include, but are notlimited to, a microphone, a speaker, a ringer, a vibrator, a lightemitting diode display, a thin-film transistor (TFT) display, a liquidcrystal display, an active-matrix organic light-emitting diode (AMOLED)display, and the like. In an example embodiment, processor 302 mayinclude I/O circuitry configured to control at least some functions ofone or more elements of I/O module 306, such as, for example, a speaker,a microphone, a display, and/or the like. Processor 302 and/or the I/Ocircuitry may be configured to control one or more functions of the oneor more elements of I/O module 306 through computer programinstructions, for example, software and/or firmware, stored on a memory,for example, the memory 304, and/or the like, accessible to theprocessor 302.

Communication interface 308 enables computing system 300 to communicatewith other entities over various types of wired, wireless orcombinations of wired and wireless networks, such as for example, theInternet. In at least one example embodiment, the communicationinterface 308 includes a transceiver circuitry configured to enabletransmission and reception of data signals over the various types ofcommunication networks. In some embodiments, communication interface 308may include appropriate data compression and encoding mechanisms forsecurely transmitting and receiving data over the communicationnetworks. Communication interface 308 facilitates communication betweencomputing system 300 and I/O peripherals.

In an embodiment, various components of computing system 300, such asprocessor 302, memory 304, I/O module 306 and communication interface308 may be configured to communicate with each other via or through acentralized circuit system 310. Centralized circuit system 310 may bevarious devices configured to, among other things, provide or enablecommunication between the components (302-308) of computing system 300.In certain embodiments, centralized circuit system 310 may be a centralprinted circuit board (PCB) such as a motherboard, a main board, asystem board, or a logic board. Centralized circuit system 310 may also,or alternatively, include other printed circuit assemblies (PCAs) orcommunication channel media.

It is noted that various example embodiments as described herein may beimplemented in a wide variety of devices, network configurations andapplications.

Those of skill in the art will appreciate that other embodiments of thedisclosure may be practiced in network computing environments with manytypes of computer system configurations, including personal computers(PCs), industrial PCs, desktop PCs), hand-held devices, multi-processorsystems, microprocessor-based or programmable consumer electronics,network PCs, server computers, minicomputers, mainframe computers, andthe like. Accordingly, system 10 may be coupled to these externaldevices via the communication, such that system 10 is controllableremotely. Embodiments may also be practiced in distributed computingenvironments where tasks are performed by local and remote processingdevices that are linked (either by hardwired links, wireless links, orby a combination thereof) through a communications network. In adistributed computing environment, program modules may be located inboth local and remote memory storage devices.

In another implementation, system 10 follows a cloud computing model, byproviding an on-demand network access to a shared pool of configurablecomputing resources (e.g., servers, storage, applications, and/orservices) that can be rapidly provisioned and released with minimal ornor resource management effort, including interaction with a serviceprovider, by a user (operator of a thin client).

The benefits and advantages described above may relate to one embodimentor may relate to several embodiments. The embodiments are not limited tothose that solve any or all of the stated problems or those that haveany or all of the stated benefits and advantages. The operations of themethods described herein may be carried out in any suitable order, orsimultaneously where appropriate. Additionally, individual blocks may beadded or deleted from any of the methods without departing from thespirit and scope of the subject matter described herein. Aspects of anyof the examples described above may be combined with aspects of any ofthe other examples described to form further examples without losing theeffect sought.

The above description is given by way of example only and variousmodifications may be made by those skilled in the art. The abovespecification, examples and data provide a complete description of thestructure and use of exemplary embodiments. Although various embodimentshave been described above with a certain degree of particularity, orwith reference to one or more individual embodiments, those skilled inthe art could make numerous alterations to the disclosed embodimentswithout departing from the spirit or scope of this specification.

What is claimed is:
 1. An applicator head for applying an adhesive tapeon a surface or substrate, wherein the adhesive tape comprises amaterial and at least one removable liner, the applicator headcomprising: an application tip; a cutting mechanism positioned adjacentan outer most point of the application tip; a positioning device isconfigured such that the cutting mechanism severs the material whilemaintaining the at least one removable liner intact.
 2. The applicatorhead of claim 1, wherein the cutting mechanism comprises a bladecomprising a straight cutting edge actuatable to sever the materialonly.
 3. The applicator head of claim 2, further comprising a bladeactuator comprising at least one of a fluidic muscle, an electricactuator, a pneumatic actuator, and a hydraulic actuator.
 4. Theapplicator head of claim 1, wherein the positioning device comprises atleast one of a threaded adjuster, an eccentric lobe, and a stop capableof modification to suit a predetermined thickness, for performingadjustments.
 5. The applicator head of claim 4, wherein the cuttingmechanism is positioned at a predetermined distance from the applicationtip.
 6. The applicator head of claim 4, wherein the cutting mechanism ispositioned away from the application tip to allow for clearance to thesubstrate.
 7. The applicator head of claim 3, wherein the blade isactuated in at least one of a horizontal, vertical and diagonal axis. 8.The applicator head of claim 2, wherein the blade is positioned to severthe material beyond the application tip in freespace.
 9. The applicatorhead of claim 2, wherein in which the blade is positioned to sever thematerial against the surface or the substrate.
 10. The applicator headof claim 2, wherein the blade is serrated.
 11. The applicator head ofclaim 2, wherein the blade is curved.
 12. The applicator head of claim2, wherein the blade is heated to assist in severing the material. 13.The applicator head of claim 5, wherein comprises at least one sensorpositioned upstream of the application tip for tracking and calculatingthe amount of material between the cutting mechanism and the applicationtip.
 14. The applicator head of claim 1, wherein the material travelsthrough a delamination device comprising rollers configured to separatethe material and the at least one removable liner from each othertemporarily before reapplying the material to the at least one removableliner to loosen the bond.
 15. The applicator head of claim 1, whereinthe cutting blade is positioned at the point in which the material isseparated from the at least one removable liner to allow for cuttingwithout impacting the at least one removable liner.
 16. The applicatorhead of claim 1, wherein the application tip comprises a rounded edgespecifically selected for the adhesive tape as to cause the material topeel from the at least one removable liner to expose the adhesive. 17.The applicator head of claim 16, wherein the application tip is coatedwith a coating composition.
 18. The applicator head of claim 17, whereinthe coating composition is non-stick and friction-less.
 19. Theapplicator head of claim 16, wherein at least one of the rounded edgeand the coating composition reduces friction and reduces the possibilityof the material sticking to the application tip.
 20. The applicator headof claim 1, wherein the application tip is coupled to source ofpressurized air to facilitate peeling of the material from the at leastone removable liner.
 21. The applicator head of claim 1, furthercomprising a bar or roller positioned adjacent the application tip toapply pressure to the adhesive tape to cause the material to curl off ofthe at least one removable liner.
 22. The applicator head of claim 1,further comprising a liner recovery mechanism to remove the at least oneremovable liner from the adhesive tape before application to asubstrate.
 23. The applicator head of claim 1, further comprising asensor located on an outbound side of the applicator tip to sense todetermine whether the material was applied correctly.
 24. The applicatorhead of claim 1, further comprising a variable loop to maintain tensionon the adhesive tape to assist with peeling and feeding thereof.
 25. Theapplicator head of claim 1, further comprising a variable loop tomaintain tension in the adhesive tape to promote precise cutting of thematerial.
 26. The applicator head of claim 1, further comprising anadditional attachment containing adhesion promoter and a device forapplying said adhesion promoter.
 27. The applicator head of claim 1,wherein the adhesive tape is double-sided.